bitboy.ro:nvda<GO>

PX_01

Price

230.36
0.84%
Updated 13:16:33 UTC
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MKT_CAP
$5.58T
PE_TTM
29.0
RANGE
164.07–236.54
SHARES_OUT
24.22B
VOL
134.95M
FLOAT_PCT
95.9%
OWN_02

Ownership breakdown — NVDA

Float filing as of Sep 5, 2026 · polled daily 06:00 UTC
LIVE DATA (PROGRAMMATIC)
FLOAT_PCT
95.9%
INSTITUTIONAL
INSIDER
SHARES_OUT
24.22B
EDGAR_SHARES
FLOAT_SHARES
23.23B
EDGAR_FLOAT_USD
MKT_CAP
$5.58T
FLOAT vs RESTRICTED (tradability, not holder identity)
95.9% freely tradable · ~4.1% restricted or non-float · institutional / insider breakdown not loaded
METRIC GUIDE — WHAT IT MEANS FOR NVDA
PUBLIC_FLOAT95.9%

Percentage of outstanding shares freely tradable on the open market — not locked by insiders, strategic holders, or transfer restrictions.

NVDAAt 95.9% public float, nearly all NVDA shares can change hands on the open market without restriction. That depth of free float is what makes NVDA one of the most liquid large-cap names in the world — tight spreads, easy entry/exit for funds, and reliable inclusion in passive index flows. Recent daily volume is about 134.95M shares.

Source: FMP /shares-float
INSTITUTIONAL

Aggregate share held by registered investment managers (Vanguard, BlackRock, pension funds, etc.), summed from SEC Form 13F quarterly filings.

NVDANot available on the current FMP plan — the /institutional-ownership/extract endpoint requires a paid tier. EDGAR 13F aggregation runs daily as fallback.

Source: FMP /institutional-ownership/extract · unavailable
INSIDER

Shares held by executives, directors, and other affiliates — typically subject to trading windows and disclosure via SEC Form 4.

NVDACannot be derived until institutional ownership is populated — computed as 100% − public float − institutional.

Source: Derived (FMP) · unavailable

Prices and market cap refresh from Twelve Data + FMP /quote on the hero ticker poll. Float % and FMP shares come from FMP /shares-float. EDGAR companyfacts cross-checks shares outstanding and public float (USD); EDGAR 13F bulk data fills institutional % when FMP 13F extract is plan-blocked. Sources: fmp-shares-float, edgar-companyfacts.

SPLY_03

Supply chain

EDA Tools (2)
EDA
CDNS
Cadence Design Systems
EDA
SNPS
Synopsys
Design (1)
FABLESS
NVDA
NVIDIA Corporation
Materials (2)
MATERIAL
— —
Silicon Wafers
MATERIAL
— —
Rare Earth / Specialty Materials
Equipment (4)
EQUIPMENT
AMAT
Applied Materials
EQUIPMENT
LRCX
Lam Research
EQUIPMENT
ASML
ASML Holding
EQUIPMENT
KLAC
KLA Corporation
Foundry (2)
FOUNDRY
GFS
GlobalFoundries
FOUNDRY
TSM
Taiwan Semiconductor Mfg (ADR)
Foundry / Memory (1)
FOUNDRY
— —
Samsung Electronics
Memory (2)
MEMORY
— —
SK Hynix
MEMORY
MU
Micron Technology
Processing / OSAT (3)
OSAT
— —
JCET Group
OSAT
ASX
ASE Technology Holding (ADR)
OSAT
AMKR
Amkor Technology
Assembly (4)
ODM
— —
Wistron
ODM
— —
Quanta Computer
ODM
— —
Foxconn / Hon Hai
ODM
SMCI
Super Micro Computer
OEM (2)
OEM
DELL
Dell Technologies
OEM
HPE
Hewlett Packard Enterprise
Board Partners (3)
BOARD
— —
Gigabyte
BOARD
— —
ASUS
BOARD
— —
MSI
Networking (2)
NETWORK
ANET
Arista Networks
NETWORK
AVGO
Broadcom
Datacenter Infra (1)
DC INFRA
VRT
Vertiv Holdings
Cloud (5)
CLOUD
MSFT
Microsoft
CLOUD
GOOGL
Alphabet
CLOUD
AMZN
Amazon
CLOUD
ORCL
Oracle
CLOUD
CRWV
CoreWeave
Retail (1)
RETAIL
BBY
Best Buy
> GLOSSARY
EDA ToolsElectronic Design Automation — software used to design, simulate, and verify chip layouts before manufacturing.
Design"Fabless" chip designers — design chips but own no factories, outsourcing manufacturing to a foundry. NVIDIA's own category.
MaterialsRaw inputs for chipmaking — silicon wafers, rare-earth elements, specialty gases and chemicals.
EquipmentMakers of the machines used inside a fab to actually manufacture chips — lithography, etching, deposition tools.
FoundryPhysically manufactures chips on behalf of fabless designers.
Foundry / MemoryHybrid — manufactures both logic chips and memory.
MemoryMakers of memory chips specifically — DRAM, HBM, NAND.
Processing / OSATOutsourced Semiconductor Assembly and Test — packages and tests raw chips after fabrication into finished components.
AssemblyOriginal Design Manufacturers that assemble finished chips into servers and systems.
OEMOriginal Equipment Manufacturers selling finished servers/systems under their own brand.
Board PartnersCompanies building graphics cards/boards around NVIDIA's chips.
NetworkingSwitches, NICs, and other gear connecting servers together inside a datacenter.
Datacenter InfraPower, cooling, and physical infrastructure for datacenters.
CloudCloud providers that buy or rent GPUs and offer them to end customers.
RetailConsumer retailers selling finished products.
DSP_04

Weekly Dispatch

2026-W36UPDATED

Groq 3 LPX joins Vera Rubin NVL72 in production; NVIDIA posts agentic efficiency metrics; B200/B300 still OEM baseline

Late August NVIDIA announced Groq 3 LPX — a low-latency inference accelerator codesigned with Vera Rubin NVL72 — is in full production, with Nebius as first cloud adopter. NVIDIA's Aug 27 blog publishes measured agentic efficiency figures (up to 30× throughput/MW vs GB300 NVL72 on SemiAnalysis AgentX — pending SemiAnalysis review). Vera CPU is described as shipping. HGX B200/B300 remain the general OEM HGX baseline.

READ FULL DISPATCH →RIVALS UPDATE →ALL EDITIONS
COMP_05

Competitors

AMDMI300/MI400 series — closest direct GPU competitor in AI acceleratorshigh
INTCGaudi accelerators + foundry ambitions (Intel Foundry)medium
Google TPUIn-house AI accelerator program for Google Cloud/DeepMind workloadsmedium
Broadcom Custom ASICsCo-designs custom AI accelerators for hyperscaler customersmedium
Amazon TrainiumIn-house AI training/inference silicon for AWSmedium
Huawei AscendAscend 910B/910C AI accelerators — primary China-market NVDA alternativehigh
NEWS_06

Signal, aggregated

INFER OFFLINE — sentiment scores, summaries, and topic tags are unavailable. 0/22 articles scored in the last 7 days. Last probe: probe returned null score and summary
MARKETWATCH.COM: Micron is doubling down on AI memory chips. That could pay off big time for investors. - marketwatch.com // FINANCE.BIGGO.COM: Micron's First Labor Mediation in Taiwan Ends Without Deal; Strike Threat Still Looms - finance.biggo.com // TECH TIMES: CXMT Hits 10% DRAM Share: Samsung’s HBM Pivot Handed China Market Vacancy - Tech Times // GLOBALSOURCES.COM: Micron Accelerates HBM Expansion as Competition Among Hardware Makers Intensifies - globalsources.com // THE GLOBE AND MAIL: ETFs to Watch as Memory-Chip Scarcity Could Extend Through 2027 - The Globe and Mail // TECH TIMES: Micron Taiwan Strike Risk: HBM Workers Claim Share of AI Memory Supercycle - Tech Times // TRADINGVIEW: ETFs to Watch as Memory-Chip Scarcity Could Extend Through 2027 - TradingView // MSHALE.COM: Samsung Vs SK Hynix Vs CXMT: Which AI Memory Stock Wins? Vfb Stuttgart – Leverkusen (OXVOBk7uW0) - mshale.com // CHOSUNBIZ: China’s CXMT starts HBM3E production, targets domestic AI chips next year - CHOSUNBIZ - Chosunbiz // BENZINGA: CXMT’s HBM3E Push Challenges Micron in AI Memory: ETFs to Watch - Micron Technology (NASDAQ:MU) - Benzinga // TRADINGVIEW: CXMT’s HBM3E Push Challenges Micron: These ETFs Play the AI Memory Boom - TradingView // FINANCE.BIGGO.COM: SK Hynix Scours Japan for New Chip Plant Sites as AI Demand Strains Supply - finance.biggo.com // 24/7 WALL ST.: The Memory Shortage Isn't Close to Ending - Samsung Just Locked Up 70% of HBM Capacity Through 2031 - 24/7 Wall St. // FINANCE.BIGGO.COM: Micron Taiwan Unions Vote 80% in Favor of Strike in Preliminary Survey — Performance Bonus Dispute Spreads to All Three Major Memory Makers - finance.biggo.com // MOOMOO: Nasdaq surges 1.5%! Micron and SK Hynix skyrocket? Is the AI tech theme losing momentum? - Moomoo // FINANCE.BIGGO.COM: AI Memory Battle Heats Up: Micron Doubles Capex, Nvidia's Purchase Commitments Surge 135% - finance.biggo.com // SEMIVISION: SK hynix Breaks Ground in Indiana: HBM’s Second Competitive Curve Is Supply-Chain Localization - semivision // SEMIVISION: SK hynix Breaks Ground in Indiana: HBM’s Second Competitive Curve Is Supply-Chain Localization - semivision // STARTUP FORTUNE: Samsung, SK Hynix and Micron Have Already Sold Out Their 2027 Memory Chips - Startup Fortune // INTELLECTIA AI: Nvidia Q2 Earnings 2026: Record $96B Revenue & AI Chip Analysis - Intellectia AI // INTELLECTIA AI: AI Chip Stocks Investment 2026: Nvidia vs AMD vs Broadcom Analysis - Intellectia AI // TRADINGKEY: NVIDIA Corp (NVDA) Stock Analysis & Forecast - TradingKey
ARTICLES
0
AVG_SENT
BULLISH
0
BEARISH
0
NEUTRAL
0
CHAIN_07

How a chip becomes a product

NVIDIA doesn't build a GPU alone — it's the product of a chain that runs through a dozen industries before it ever reaches a datacenter or a desk. Here's that chain, start to finish.

01
EDA Tools

Before a single transistor is drawn, engineers need software just to design the chip. EDA (Electronic Design Automation) tools let designers lay out billions of transistors and simulate how they'll behave — catching errors here costs a bug fix; catching them after fabrication costs a $100M wafer run.

CDNSSNPS
02
Design

This is where NVIDIA itself sits. A "fabless" designer owns no factories — its product is the chip's architecture, not the physical silicon. NVIDIA designs the GPU; someone else has to actually build it.

NVDA
03
Materials

Manufacturing starts with raw materials: ultra-pure silicon wafers, plus a long list of rare-earth elements and specialty chemicals that never make headlines but without which nothing else on this list works.

Silicon WafersRare Earth / Specialty Materials
04
Equipment

Turning silicon and chemicals into a working chip takes some of the most complex machines ever built — lithography systems that print circuits smaller than a virus, and the etching and deposition tools that build a chip up layer by layer.

AMATLRCXASMLKLAC
05
Foundry

The foundry is where the chip is actually fabricated — hundreds of process steps over weeks, on wafers that cost more than a car. NVIDIA doesn't own a foundry; it pays someone else to run theirs.

GFSTSM
06
Foundry / Memory

A smaller group of companies straddle both worlds, fabricating logic chips and memory side by side under one roof.

Samsung Electronics
07
Memory

A GPU without memory next to it is just an expensive calculator. High-bandwidth memory (HBM) sits inches from the chip, feeding it data fast enough to keep up with it.

SK HynixMU
08
Processing / OSAT

A freshly fabricated wafer isn't a product yet — it has to be cut into individual dies, tested, and packaged into the chip you'd recognize. This step (OSAT — outsourced assembly and test) is where defective dies get caught before they ship anywhere.

JCET GroupASXAMKR
09
Assembly

Individual chips get assembled onto boards and into full servers here — the unglamorous, extremely high-volume work of turning components into machines.

WistronQuanta ComputerFoxconn / Hon HaiSMCI
10
OEM

The finished servers get a brand on them and go out the door under a name enterprise buyers recognize and order directly from.

DELLHPE
11
Board Partners

For GPUs sold to consumers rather than datacenters, board partners build the actual graphics card around NVIDIA's chip — the cooler, the PCB, the box you'd see on a shelf.

GigabyteASUSMSI
12
Networking

A datacenter full of GPUs is only as fast as the network connecting them. High-speed switches and network cards move data between thousands of GPUs working on the same problem simultaneously.

ANETAVGO
13
Datacenter Infra

None of this runs without power and cooling. As GPU racks get denser and hotter, keeping them running has become an industry of its own.

VRT
14
Cloud

Most people never buy a GPU directly — they rent time on one. Cloud providers buy GPUs at enormous scale and resell compute by the hour.

MSFTGOOGLAMZNORCLCRWV
15
Retail

And for the GPUs that do end up in someone's own PC, retail is the last stop between the factory and the desk.

BBY
GPU_08

GPU Catalog

NVIDIA datacenter GPUs are fabbed via Samsung Electronics, GlobalFoundries and Taiwan Semiconductor Mfg (ADR) — see the supply-chain graph for foundry → NVDA edges.

CDNA4 '25AMDMach-1 '25SAMSUNGBlackwell '24NVIDIACDNA3 '23AMDHopper '22NVIDIAAscend '19HUAWEI
CMPSKUVENDORARCHMEMBWTDPFP16DOCS
AMD Radeon RX 7900 XTX
RX-7900-XTX
Consumer GPU reference; not datacenter AI but competes with GeForce.
amdRDNA324 GB GDDR6960 GB/s355 W[PAGE]
AMD Instinct MI300X
MI300X-OAM-192GB
CDNA3 accelerator; 192GB HBM3; primary NVDA H100 competitor.
amdCDNA3192 GB HBM35,300 GB/s750 W[PAGE]
AMD Instinct MI325X
MI325X-OAM-256GB
HBM3e refresh of MI300X; 256GB capacity.
amdCDNA3256 GB HBM3e6,000 GB/s1000 W[PAGE]
AMD Instinct MI355X
MI355X-OAM-288GB
CDNA4 generation; targets Blackwell B200 class workloads.
amdCDNA4288 GB HBM3e8,000 GB/s1400 W[PAGE]
Huawei Ascend 910B
ASCEND-910B
Primary China-market AI training chip; specs from Huawei Ascend product documentation.
huaweiAscend64 GB HBM2e400 W320 TFLOPS[PAGE][ARCH]
Huawei Ascend 910C
ASCEND-910C
Successor Ascend generation; public spec sheet limited outside China — verify before production use.
huaweiAscend[PAGE][ARCH]
NVIDIA GeForce RTX 5090
RTX-5090
Consumer Blackwell flagship; 32GB GDDR7.
nvidiaBlackwell32 GB GDDR7575 W[PAGE][ARCH]
NVIDIA B200 SXM
B200-SXM-192GB
Blackwell datacenter GPU; FP4 native; 5th-gen NVLink.
nvidiaBlackwell192 GB HBM3e8,000 GB/s1000 W[PAGE][ARCH]
NVIDIA GB200 Grace Blackwell Superchip
GB200-SUPERCHIP
2x B200 GPU + Grace CPU; aggregate 384GB HBM3e per superchip module.
nvidiaBlackwell384 GB HBM3e2700 W[PAGE]
NVIDIA H100 PCIe
H100-PCIe-80GB
PCIe FHFL dual-slot; 350W default TGP mode.
nvidiaHopper80 GB HBM2e2,000 GB/s350 W[PAGE][PDF]
NVIDIA H100 SXM5
H100-SXM5-80GB
SXM5 variant; FP8/FP16 from NVIDIA product spec table (sparse peak).
nvidiaHopper80 GB HBM33,350 GB/s700 W1,979 TFLOPS[PAGE][PDF]
NVIDIA H200 SXM
H200-SXM-141GB
Hopper refresh with HBM3e; ~1.4x memory capacity vs H100.
nvidiaHopper141 GB HBM3e4,800 GB/s700 W[PAGE]
NVIDIA L40S
L40S-48GB
Inference/visualization GPU; Ada architecture, not Hopper/Blackwell.
nvidiaAda Lovelace48 GB GDDR6864 GB/s350 W[PAGE]
NVIDIA RTX PRO 6000 Blackwell
RTX-PRO-6000-BLACKWELL
Workstation Blackwell; 96GB GDDR7 ECC.
nvidiaBlackwell96 GB GDDR71,792 GB/s600 W[PAGE]
Samsung HBM3E 12-Hi Stack
SAMSUNG-HBM3E-12H
Memory component used by NVDA/AMD accelerators — supply-chain competition, not a compute GPU.
samsungHBM3E36 GB HBM3E[PAGE]
Samsung Mach-1 AI Accelerator
MACH-1-AI
Inference-focused logic chip roadmap; Samsung also competes as HBM supplier (see supply chain). Not a direct GeForce/datacenter GPU SKU.
samsungMach-1[PAGE][ARCH]