A second CoWoS interposer source in New York; Samsung HBM4E reportedly clears NVIDIA qualification
UPDATEDOn 8 October, GlobalFoundries signed a $2B, five-year agreement to make silicon interposers for TSMC's CoWoS packaging at Malta, New York, with volume ramping in the first half of 2028. A 7 October Korean report says Samsung's 12-high HBM4E passed NVIDIA qualification, which neither company has confirmed. H200, HGX B200 and RTX PRO 6000 are unchanged on vendor pages. RTX PRO 5500 is still 'Coming Soon'.
NVDA ecosystem — weekly dispatch (2026-W42)
### Packaging: GlobalFoundries to make CoWoS interposers for TSMC
On 8 October, GlobalFoundries announced a $2 billion, multi-year agreement to provide manufacturing services to TSMC for silicon interposers used in CoWoS, including parts with embedded deep trench capacitors. Capacity is being added at GF's Malta, New York site. Volume production is due to start ramping in the first half of 2028. The initial term is five years, with a framework to expand. GF calls it the first U.S.-based source of these interposers.
The interposer is the silicon layer that connects a GPU die to its HBM stacks inside the package. The agreement covers interposers only, not assembly or test. This is recorded as an event under Supply chain and Chip journey.
### Memory: Samsung HBM4E reportedly qualified
KED Global (Hankyung) reported on 7 October, citing unnamed sources, that Samsung's 12-high HBM4E passed qualification with NVIDIA and major hyperscalers. Neither Samsung nor NVIDIA has confirmed it. No NVIDIA product, supply volume or production date was reported. Samsung's HBM page still lists HBM4E at up to 64 GB and 4 TB/s per 16-high stack on a 4 nm foundry base die, and does not state production status. This is recorded as a rumoured event.
### Market moves (in the event log, not restated)
NVIDIA took confirmed minority stakes in Doctolib and Genesis AI (13 October). The FT reported early talks to buy or invest further in Reflection AI (10 October). See Market moves.
### RTX PRO 5500: still "Coming Soon"
The vendor page is unchanged: 84 GB GDDR7 ECC, 1,398 GB/s, up to 600 W, two-way MIG, availability "Coming Soon".
### Catalog re-verification
- H200 SXM: 141 GB, 4.8 TB/s, up to 700 W configurable, 3,958 TFLOPS FP8 (sparse). Unchanged.
- HGX B200: 1.4 TB total memory, 1.8 TB/s NVLink per GPU, 14.4 TB/s total, 72 PFLOPS FP8 sparse, 144 PFLOPS FP4 sparse. Unchanged. HGX B300 and B200 are listed as "shipping now", and Vera Rubin as "ramping into full production".
- RTX PRO 6000 Blackwell: 96 GB GDDR7, 1,792 GB/s, 600 W, 4,000 FP4 AI TOPS. Unchanged.
Catalog unchanged.
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Technical research for informational purposes only. Not financial advice. No investment recommendations. Specs sourced from vendor documentation; verify before engineering or procurement decisions.
The interposer is one step of CoWoS, not the whole of it. A second interposer source widens that step from 2028, but chip placement, HBM integration, substrates and test still limit packaged output. The deal adds redundancy to the packaging chain more than it adds near-term volume.