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GPU Dispatch · 2026-W42

DISPATCH 2026-W42 · published 10/15/2026 UTC

A second CoWoS interposer source in New York; Samsung HBM4E reportedly clears NVIDIA qualification

UPDATED

On 8 October, GlobalFoundries signed a $2B, five-year agreement to make silicon interposers for TSMC's CoWoS packaging at Malta, New York, with volume ramping in the first half of 2028. A 7 October Korean report says Samsung's 12-high HBM4E passed NVIDIA qualification, which neither company has confirmed. H200, HGX B200 and RTX PRO 6000 are unchanged on vendor pages. RTX PRO 5500 is still 'Coming Soon'.

NVDA ecosystem — weekly dispatch (2026-W42)

### Packaging: GlobalFoundries to make CoWoS interposers for TSMC

On 8 October, GlobalFoundries announced a $2 billion, multi-year agreement to provide manufacturing services to TSMC for silicon interposers used in CoWoS, including parts with embedded deep trench capacitors. Capacity is being added at GF's Malta, New York site. Volume production is due to start ramping in the first half of 2028. The initial term is five years, with a framework to expand. GF calls it the first U.S.-based source of these interposers.

The interposer is the silicon layer that connects a GPU die to its HBM stacks inside the package. The agreement covers interposers only, not assembly or test. This is recorded as an event under Supply chain and Chip journey.

### Memory: Samsung HBM4E reportedly qualified

KED Global (Hankyung) reported on 7 October, citing unnamed sources, that Samsung's 12-high HBM4E passed qualification with NVIDIA and major hyperscalers. Neither Samsung nor NVIDIA has confirmed it. No NVIDIA product, supply volume or production date was reported. Samsung's HBM page still lists HBM4E at up to 64 GB and 4 TB/s per 16-high stack on a 4 nm foundry base die, and does not state production status. This is recorded as a rumoured event.

### Market moves (in the event log, not restated)

NVIDIA took confirmed minority stakes in Doctolib and Genesis AI (13 October). The FT reported early talks to buy or invest further in Reflection AI (10 October). See Market moves.

### RTX PRO 5500: still "Coming Soon"

The vendor page is unchanged: 84 GB GDDR7 ECC, 1,398 GB/s, up to 600 W, two-way MIG, availability "Coming Soon".

### Catalog re-verification

  • H200 SXM: 141 GB, 4.8 TB/s, up to 700 W configurable, 3,958 TFLOPS FP8 (sparse). Unchanged.
  • HGX B200: 1.4 TB total memory, 1.8 TB/s NVLink per GPU, 14.4 TB/s total, 72 PFLOPS FP8 sparse, 144 PFLOPS FP4 sparse. Unchanged. HGX B300 and B200 are listed as "shipping now", and Vera Rubin as "ramping into full production".
  • RTX PRO 6000 Blackwell: 96 GB GDDR7, 1,792 GB/s, 600 W, 4,000 FP4 AI TOPS. Unchanged.

Catalog unchanged.

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Technical research for informational purposes only. Not financial advice. No investment recommendations. Specs sourced from vendor documentation; verify before engineering or procurement decisions.

ANALYSIS

The interposer is one step of CoWoS, not the whole of it. A second interposer source widens that step from 2028, but chip placement, HBM integration, substrates and test still limit packaged output. The deal adds redundancy to the packaging chain more than it adds near-term volume.

[GlobalFoundries: U.S.-based silicon interposer supply agreement with TSMC][KED Global: Samsung HBM4E passes qualification (unconfirmed)][Samsung HBM][NVIDIA RTX PRO 5500 Blackwell][NVIDIA RTX PRO 6000 Blackwell][NVIDIA H200][NVIDIA HGX B200]

IDC: NVIDIA's China accelerator share fell to 34% in H1 2026, with Huawei at 28% and non-GPU accelerators outshipping GPUs

UPDATED

IDC data reported on 13 October covers China's H1 2026 market. NVIDIA shipped about 678,000 accelerators there, down 44% year on year, for a 34% share. Huawei shipped about 572,000, a 28% share. Non-GPU accelerators (about 1.016M) outshipped GPUs (about 991,000) for the first time. Separately, Amazon is reportedly in talks to buy Decart, a startup NVIDIA has invested in, for about $7B. AMD's MI355X page was unreachable again, so its values carry forward.

Rivals — weekly dispatch (2026-W42)

### China: IDC's first-half figures

IDC data, reported by Reuters on 13 October, covers China's AI accelerator market for January–June 2026, about 2.0 million units in total:

| Vendor | Units (H1 2026) | Share | |---|---|---| | NVIDIA | ~678,000 (−44% YoY) | 34% | | Huawei | ~572,000 (from just over 300,000) | 28% | | Alibaba T-Head | — | 7% | | Cambricon | — | 5% | | Baidu Kunlunxin | — | 4% | | Hygon | — | 3% |

Non-GPU accelerators (ASICs and NPUs) reached about 1.016 million units, up nearly 80%. That is the first time they outshipped GPUs (about 991,000, down 26%) in China. Nine of the eleven Chinese vendors IDC tracks grew shipments. IDC did not break out which NVIDIA products make up its share. NVIDIA did not comment.

These are the first independent figures since Huawei's 1 October claim that Ascend has passed NVIDIA in China. On units, H1 does not support that claim. The trend does: Huawei nearly doubled while NVIDIA fell 44%.

### Amazon / Decart (reported)

The WSJ reported, relayed by Reuters on 12 October, that Amazon is in talks to buy Decart for about $7 billion. Decart makes real-time video models and simulation environments. NVIDIA joined Decart's May round as an investor. Coverage frames the deal as support for Amazon's Trainium. That framing comes from reporting, not from Amazon. This is recorded as a rumoured event under Competitors.

### AMD

AMD's MI355X page timed out twice again this run. Catalog values (288 GB HBM3E, 8 TB/s, 1,400 W) carry forward from W40's verification. This run found no primary confirmation of MI450-family shipments.

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Technical research for informational purposes only. Not financial advice. No investment recommendations. Specs sourced from vendor documentation; verify before engineering or procurement decisions.

ANALYSIS

IDC's figures are the first independent numbers behind Huawei's 1 October claim that it leads in China, and they do not support that claim for H1: NVIDIA still shipped more units. The more structural signal is the product mix. ASICs and NPUs passing GPUs by volume means the Chinese market is moving away from the GPU form factor, and away from CUDA with it.

[IDC China H1 2026 AI accelerator figures (via Reuters)][Reuters via JPost: Amazon in talks to buy Decart (WSJ)][AMD Instinct MI355X (unreachable this run)]

Model spotlights

B200-SXM-192GB

The shipping Blackwell baseline, and a CoWoS-packaged part whose interposer supply gains a second source from 2028.

  • 192 GB HBM3e per GPU at 8 TB/s (catalog)
  • HGX B200: 1.4 TB total memory, 1.8 TB/s NVLink per GPU, 14.4 TB/s total
  • 72 PFLOPS FP8 / 144 PFLOPS FP4 sparse per HGX system
  • Packaging: TSMC CoWoS. GlobalFoundries will add U.S. interposer capacity for CoWoS from H1 2028
ANALYSIS

Unchanged on the vendor page, which still lists HGX B300 and B200 as shipping and Rubin as ramping into full production.

ASCEND-910B

IDC puts Huawei at about 572,000 accelerators and 28% of China in H1 2026, nearly double a year earlier.

  • 64 GB HBM2e, 400 W (catalog)
  • Software: CANN, plus DeepSeek's open-source Ascend libraries and TileLang adapter (W41)
  • IDC: non-GPU accelerators outshipped GPUs in China for the first time in H1 2026
ANALYSIS

IDC's unit figures are independent. They show Huawei growing fast but still behind NVIDIA in H1, which contradicts Huawei's own claim of leadership.

H200-SXM-141GB

The HBM3e Hopper part, and the chip at the centre of US licensing policy for China while IDC shows NVIDIA's China share falling.

  • 141 GB HBM3e, 4.8 TB/s
  • Up to 700 W configurable
  • 3,958 TFLOPS FP8 (sparse)
  • Vendor page re-verified this run
ANALYSIS

Unchanged. IDC did not say which NVIDIA parts make up its H1 China figures.

RTX-PRO-6000-BLACKWELL

NVIDIA's GDDR7 tier with MIG, which sits outside the HBM constraint. Its sibling, the RTX PRO 5500, is still 'Coming Soon'.

  • 96 GB GDDR7 ECC, 1,792 GB/s, 600 W, 4,000 FP4 AI TOPS (re-verified)
  • RTX PRO 5500: 84 GB, 1,398 GB/s, up to 600 W, two-way MIG, 'Coming Soon'
ANALYSIS

Unchanged.

MI355X-OAM-288GB

The catalogued AMD flagship, ahead of the MI450-family / Helios ramp.

  • 288 GB HBM3E, 8 TB/s, 1,400 W TBP, CDNA 4 (catalog)
  • Successor MI455X in Helios racks per AMD guidance. No primary shipment confirmation this run
ANALYSIS

AMD's page was unreachable this run, so values carry forward from W40's verification.

Comparison matrix

DimensionB200-SXM-192GBH200-SXM-141GBMI355X-OAM-288GBASCEND-910B
GPU memory (GB)19214128864
Memory bandwidth (GB/s)800048008000—
Memory typeHBM3eHBM3eHBM3EHBM2e
ArchitectureBlackwellHopperCDNA4Ascend
TDP / TBP (W)10007001400400
Form factorSXMSXMOAMOAM
ANALYSIS

NVIDIA values were re-verified against vendor pages this run. AMD MI355X values carry forward from W40 because AMD's page was unreachable in W41 and W42.

[NVIDIA HGX B200][NVIDIA H200][AMD Instinct MI355X][Huawei Ascend / Atlas 960E]