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The NVIDIA supply chain — who makes what, and where it can break

35 tracked companies across 15 stages, from the software used to design a chip to the cloud racks that rent the finished GPU. Click any node to trace what it supplies and what supplies it.

The live view

EDA Tools (2)
EDA
CDNS
Cadence Design Systems
EDA
SNPS
Synopsys
Design (1)
FABLESS
NVDA
NVIDIA Corporation
Materials (2)
MATERIAL
— —
Silicon Wafers
MATERIAL
— —
Rare Earth / Specialty Materials
Equipment (4)
EQUIPMENT
AMAT
Applied Materials
EQUIPMENT
LRCX
Lam Research
EQUIPMENT
ASML
ASML Holding
EQUIPMENT
KLAC
KLA Corporation
Foundry (2)
FOUNDRY
GFS
GlobalFoundries
FOUNDRY
TSM
Taiwan Semiconductor Mfg (ADR)
Foundry / Memory (1)
FOUNDRY
— —
Samsung Electronics
Memory (2)
MEMORY
— —
SK Hynix
MEMORY
MU
Micron Technology
Processing / OSAT (3)
OSAT
— —
JCET Group
OSAT
ASX
ASE Technology Holding (ADR)
OSAT
AMKR
Amkor Technology
Assembly (4)
ODM
— —
Wistron
ODM
— —
Quanta Computer
ODM
— —
Foxconn / Hon Hai
ODM
SMCI
Super Micro Computer
OEM (2)
OEM
DELL
Dell Technologies
OEM
HPE
Hewlett Packard Enterprise
Board Partners (3)
BOARD
— —
Gigabyte
BOARD
— —
ASUS
BOARD
— —
MSI
Networking (2)
NETWORK
ANET
Arista Networks
NETWORK
AVGO
Broadcom
Datacenter Infra (1)
DC INFRA
VRT
Vertiv Holdings
Cloud (5)
CLOUD
MSFT
Microsoft
CLOUD
GOOGL
Alphabet
CLOUD
AMZN
Amazon
CLOUD
ORCL
Oracle
CLOUD
CRWV
CoreWeave
Retail (1)
RETAIL
BBY
Best Buy
> GLOSSARY
EDA ToolsElectronic Design Automation — software used to design, simulate, and verify chip layouts before manufacturing.
Design"Fabless" chip designers — design chips but own no factories, outsourcing manufacturing to a foundry. NVIDIA's own category.
MaterialsRaw inputs for chipmaking — silicon wafers, rare-earth elements, specialty gases and chemicals.
EquipmentMakers of the machines used inside a fab to actually manufacture chips — lithography, etching, deposition tools.
FoundryPhysically manufactures chips on behalf of fabless designers.
Foundry / MemoryHybrid — manufactures both logic chips and memory.
MemoryMakers of memory chips specifically — DRAM, HBM, NAND.
Processing / OSATOutsourced Semiconductor Assembly and Test — packages and tests raw chips after fabrication into finished components.
AssemblyOriginal Design Manufacturers that assemble finished chips into servers and systems.
OEMOriginal Equipment Manufacturers selling finished servers/systems under their own brand.
Board PartnersCompanies building graphics cards/boards around NVIDIA's chips.
NetworkingSwitches, NICs, and other gear connecting servers together inside a datacenter.
Datacenter InfraPower, cooling, and physical infrastructure for datacenters.
CloudCloud providers that buy or rent GPUs and offer them to end customers.
RetailConsumer retailers selling finished products.

Background

Why the foundry is the chokepoint

A leading-edge fab costs on the order of twenty billion dollars and takes years to bring up. NVIDIA owns none — it designs the chip and pays a foundry to build it, which means its output ceiling is set by someone else's capacity decisions made years earlier.

Why packaging became the bottleneck

A modern accelerator isn't one chip — it's a die bonded to stacks of memory on a shared substrate. That advanced-packaging step has repeatedly been the binding constraint on how many accelerators exist, rather than the wafers themselves.

Why memory decides the ceiling

High-bandwidth memory sits beside the processor and feeds it. Only a handful of firms can make it, so how much HBM exists — and who has contracted for it — effectively caps how many accelerators ship and how large a model each one can hold.

Reading this graph

Stages run left to right in the order a chip passes through them, and an arrow means the company on the left supplies the one on the right. Definitions for each stage are in the glossary under the graph.

Latest on the chain

SEP 08China's CXMT Breaks 10% DRAM Market Share... "Supply Shortage to Persist in H2" - finance.biggo.comfinance.biggo.SEP 08SK Hynix Jumps 7% as AI Diverts Memory From Phones, Micron Holds Steady, Apple Slips - 24/7 Wall St.24/7 Wall St.SEP 08SK Hynix's Capital-Return Paradox: Handing Back Cash While Its Core Product Sells Itself - AD HOC NEWSAD HOC NEWSSEP 08AI: China’s CXMT’s #4 HBM rank, & Apple iPhone bid. AI-RTZ #1203 - AI: Reset to ZeroAI: Reset to ZSEP 07Samsung's DRAM Share Nears 40%... Micron Closes Gap with SK Hynix to 1.6 Percentage Points - finance.biggo.comfinance.biggo.SEP 07Samsung, SK Hynix Earnings Set to Climb Further as AI Spending Surge Tightens Memory Supply - en.bloomingbit.ioen.bloomingbitSEP 07AI Demand Drives DRAM Industry Revenue Up Nearly 60% QoQ; Samsung Holds Top Spot - finance.biggo.comfinance.biggo.SEP 07Micron’s Taiwan Labor Dispute Continues to Escalate: What Does It Mean for MU and HBM Supply? - TradingKeyTradingKeySEP 06US, Japan emerge as Korean chipmakers' production bases amid AI boom - The Korea TimesThe Korea TimeSEP 06Micron CEO touts U.S. investment as differentiator amid targeted tariff pressure on Samsung, SK - finance.biggo.comfinance.biggo.SEP 04Micron is doubling down on AI memory chips. That could pay off big time for investors. - marketwatch.commarketwatch.coSEP 04Micron Plans to Double Monthly HBM Capacity to 100,000 Wafers to Catch Up With Samsung and SK Hynix - TradingKeyTradingKeySEP 04Micron's First Labor Mediation in Taiwan Ends Without Deal; Strike Threat Still Looms - finance.biggo.comfinance.biggo.SEP 03CXMT Hits 10% DRAM Share: Samsung’s HBM Pivot Handed China Market Vacancy - Tech TimesTech TimesSEP 03Micron Accelerates HBM Expansion as Competition Among Hardware Makers Intensifies - globalsources.comglobalsources.SEP 03DDR5 RAM Hits $400 for 32GB as Prices Soar 485% [2026] - tech-insider.orgtech-insider.oSEP 02ETFs to Watch as Memory-Chip Scarcity Could Extend Through 2027 - The Globe and MailThe Globe and SEP 02Micron Taiwan Strike Risk: HBM Workers Claim Share of AI Memory Supercycle - Tech TimesTech TimesSEP 02ETFs to Watch as Memory-Chip Scarcity Could Extend Through 2027 - TradingViewTradingViewSEP 02The AI boom has made memory chips the star of the show; Singapore stakes its role in advanced packaging - Singapore Economic Development Board (EDB)Singapore EconSEP 01Samsung Builds 8-Layer HBM4E for Nvidia at 18Gbps [2026] - shattered.ioshattered.ioSEP 01Samsung Vs SK Hynix Vs CXMT: Which AI Memory Stock Wins? Vfb Stuttgart – Leverkusen (OXVOBk7uW0) - mshale.commshale.comSEP 01China’s CXMT starts HBM3E production, targets domestic AI chips next year - CHOSUNBIZ - ChosunbizChosunbizAUG 31CXMT’s HBM3E Push Challenges Micron: These ETFs Play the AI Memory Boom - TradingViewTradingViewAUG 31CXMT’s HBM3E Push Challenges Micron in AI Memory: ETFs to Watch - Micron Technology (NASDAQ:MU) - BenzingaBenzinga

What changed

No structural changes recorded yet — the weekly research pass writes them.

GRAPH LAST CONFIRMED 2026-07-07